Intel Core i31005G1 Processor 4M Cache up to 3.40 GHz Product Specifications

Processor Number

The Intel processor number is just one of several factors — along with processor brand, system configurations, and system-level benchmarks — to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel ® processor numbers or Intel ® processor numbers for the Data Center .

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

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Use Conditions

Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component ( die or chip ) .

Total Threads

Where applicable, Intel ® Hyper-Threading Technology is only available on Performance-cores .

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel ® Turbo Boost Technology and, if present, Intel ® Turbo Boost Max Technology 3.0 and Intel ® Thermal Velocity Boost. Frequency is typically measured in gigahertz ( GHz ), or billion cycles per second .

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor’s transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz ( GHz ), or billion cycles per second .

Cache

CPU Cache is an area of fast memory located on the processor. Intel ® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache .

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus ( FSB ), which carries data between the CPU and memory controller hub ; direct truyền thông interface ( DMI ), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I / O controller hub on the computer’s motherboard ; and Quick Path Interconnect ( QPI ), which is a point-to-point interconnect between the CPU and the integrated memory controller .

TDP

Thermal Design Power ( TDP ) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements .

Configurable TDP-down Base Frequency

Configurable TDP-down Base Frequency is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The Configurable TDP-down Base Frequency is where the Configurable TDP-down is defined. Frequency is typically measured in gigahertz ( GHz ), or billion cycles per second .

Configurable TDP-down

Configurable TDP-down is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The use of Configurable TDP-down is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-down is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-down frequency under an Intel-defined, high-complexity workload .

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification ( PRQ ) report. See your Intel representative for details .

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor .

Memory Types

Intel ® processors come in four different types : Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that tư vấn multiple memory channels .

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application .

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor ( in GB / s ) .

ECC Memory Supported ‡

ECC Memory Supported indicates processor tư vấn for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory tư vấn requires both processor and chipset tư vấn .

Processor Graphics ‡

Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, compute, media, and display capabilities. Processor graphics brands include Intel® Iris® Xe Graphics, Intel® UHD Graphics, Intel® HD Graphics, Iris® Graphics, Iris® Plus Graphics, and Iris® Pro Graphics. See the Intel® Graphics Technology for more information.

Intel® Iris® Xe Graphics only: to use the Intel® Iris® Xe brand, the system must be populated with 128-bit (dual channel) memory. Otherwise, use the Intel® UHD brand.

Graphics Base Frequency

Graphics Base frequency refers to the rated / guaranteed graphics render clock frequency in MHz .

Graphics Max Dynamic Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency ( in MHz ) that can be supported using Intel ® HD Graphics with Dynamic Frequency feature .

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices .

Max Resolution (HDMI)‡

Max Resolution ( HDMI ) is the maximum resolution supported by the processor via the HDMI interface ( 24 bits per px và 60H z ). System or device display resolution is dependent on multiple system design factors ; actual resolution may be lower on your system .

Max Resolution (DP)‡

Max Resolution ( DP ) is the maximum resolution supported by the processor via the DP interface ( 24 bits per px và 60H z ). System or device display resolution is dependent on multiple system design factors ; actual resolution may be lower on your system .

Max Resolution (eDP – Integrated Flat Panel)‡

Max Resolution ( Integrated Flat Panel ) is the maximum resolution supported by the processor for a device with an integrated flat panel ( 24 bits per px và 60H z ). System or device display resolution is dependent on multiple system design factors ; actual resolution may be lower on your device .

DirectX* Support

DirectX * Support indicates tư vấn for a specific version of Microsoft’s collection of APIs ( Application Programming Interfaces ) for handling multimedia compute tasks .

OpenGL* Support

OpenGL ( Open Graphics Library ) is a cross-language, multi-platform API ( Application Programming Interface ) for rendering 2D and 3D vector graphics .

Intel® Quick Sync Video

Intel® Quick Sync Video delivers fast conversion of video for portable media players, online sharing, and video editing and authoring.

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PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express ( or PCIe ) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions tư vấn different data rates .

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard .

TJUNCTION

Junction Temperature is the maximum temperature allowed at the processor die .

Intel® Gaussian & Neural Accelerator

Intel ® Gaussian và Neural Accelerator ( GNA ) is an ultra-low power accelerator block designed to run audio and speed-centric AI workloads. Intel ® GNA is designed to run audio based neural networks at ultra-low power, while simultaneously relieving the CPU of this workload .

Intel® Deep Learning Boost (Intel® DL Boost)

A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction ( VNNI ) that significantly increases deep learning inference performance over previous generations .

Intel® Adaptix™ Technology

Intel ® Adaptix ™ Technology is a collection of software tools used to tune the system for maximum performance and customize advanced system settings for such things as overclocking and graphics. Thes e software tools help the system adapt these settings to its environment, utilizing machine learning algorithms and advanced power control settings .

Intel® Optane™ Memory Supported ‡

Intel ® Optane ™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel ® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel ® Optane ™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements .

Intel® Speed Shift Technology

Intel ® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient ( short duration ) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency .

Intel® Thermal Velocity Boost

Intel ® Thermal Velocity Boost ( Intel ® TVB ) is a feature that opportunistically and automatically increases clock frequency above single-core and multi-core Intel ® Turbo Boost Technology frequencies based on how much the processor is operating below its maximum temperature and whether turbo power budget is available. The frequency gain and duration is dependent on the workload, capabilities of the processor and the processor cooling solution .

Intel® Turbo Boost Technology ‡

Intel ® Turbo Boost Technology dynamically increases the processor’s frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t .

Intel® Hyper-Threading Technology ‡

Intel ® Hyper-Threading Technology ( Intel ® HT Technology ) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner .

Intel® Transactional Synchronization Extensions

Intel ® Transactional Synchronization Extensions ( Intel ® TSX ) are a set of instructions that add hardware transactional memory tư vấn to improve performance of multi-threaded software .

Intel® 64 ‡

Intel ® 64 architecture delivers 64 – bit computing on server, workstation, desktop and mobile platforms when combined with supporting software. ¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory .

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with .

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. Thes e can include SSE ( Streaming SIMD Extensions ) and AVX ( Advanced Vector Extensions ) .

Idle States

Idle States ( C-states ) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states .

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor ( DTS ) detects the core’s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits .

Intel® AES New Instructions

Intel ® AES New Instructions ( Intel ® AES-NI ) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example : applications that perform bulk encryption / decryption, authentication, random number generation, and authenticated encryption .

Secure Key

Intel ® Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encryption algorithms .

Intel® Software Guard Extensions (Intel® SGX)

Intel ® Software Guard Extensions ( Intel ® SGX ) provide applications the ability to create hardware enforced trusted execution protection for their applications ’ sensitive routines and data. Intel ® SGX provides developers a way to partition their code and data into CPU hardened trusted execution environments ( TEE’s ) .

Intel® Trusted Execution Technology ‡

Intel ® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel ® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system .

Execute Disable Bit ‡

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network .

Intel® Boot Guard

Intel ® Device Protection Technology with Boot Guard helps protect the system’s pre-OS environment from viruses and malicious software attacks .

Intel® Stable IT Platform Program (SIPP)

The Intel® Stable IT Platform Program (Intel® SIPP) aims for zero changes to key platform components and drivers for at least 15 months or until the next generational release, reducing complexity for IT to effectively manage their computing endpoints.
Learn more about Intel® SIPP

Intel® Virtualization Technology (VT-x) ‡

Intel ® Virtualization Technology ( VT-x ) allows one hardware platform to function as multiple “ virtual ” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions .

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Intel® Virtualization Technology for Directed I/O (VT-d) ‡

Intel ® Virtualization Technology for Directed I / O ( VT-d ) continues from the existing tư vấn for IA-32 ( VT-x ) and Itanium ® processor ( VT-i ) virtualization adding new tư vấn for I / O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I / O devices in virtualized environments .

Intel® VT-x with Extended Page Tables (EPT) ‡

Intel ® VT-x with Extended Page Tables ( EPT ), also known as Second Level Address Translation ( SLAT ), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel ® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management .

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